James J.-Q. Lü

James J.-Q. Lü
Professor, Curriculum Chair
Electrical, Computer, and Systems Engineering
CII 6229


Dr.rer.nat. (Ph.D.), Technical University of Munich, Germany

Focus Area

Semiconductor Technologies:, 3D-ICs, Heterogeneous Integration (HI), Smart System Hyper-Integration;, Hybrid Bonding, TSV, Chiplet Assembly, Glass Interposer, Advanced Packaging, Reliability;, Modeling/Simulation, Power & Signal Integrity;, Nano-Micro-electronics, Materials, Devices, Fabrication & Integration;, THz Devices, Power Devices, Neutron Detectors;, Self-Assembly, LED Display.

Selected Scholarly Works

Handbook of Wafer Bonding, http://www.wiley.com/WileyCDA/WileyTitle/productCd-3527326464.html; Wiley-VCH Verlag, March 2012. ISBN: 978-3-527-32646-4.

J.-Q. Lu, “3D Hyper-Integration and Packaging Technologies for Micro-Nano-Systems,” Proceedings of The IEEE, “Special Issue: 3D Integration Technology”, 97 (1), pp. 18-30, January 2009. (http://homepages.rpi.edu/~luj/3DHIP_Proc_IEEE_2009.pdf)