Electrical, Computer, and Systems Engineering
Ph.D., Technical University of Munich, Germany
Focus AreaLED Display and Lighting, Solar Cell and Fuel Cell Technology, Nano-Micro-electronics, materials, devices, fabrication & Integration, Photonics, Power Electronics, Neutron Detection Devices, Smart System Hyper-Integration
Selected Scholarly WorksHandbook of Wafer Bonding, http://www.wiley.com/WileyCDA/WileyTitle/productCd-3527326464.html; Wiley-VCH Verlag, March 2012. ISBN: 978-3-527-32646-4.
J.-Q. Lu, “3D Hyper-Integration and Packaging Technologies for Micro-Nano-Systems,” Proceedings of The IEEE, “Special Issue: 3D Integration Technology”, 97 (1), pp. 18-30, January 2009. (http://homepages.rpi.edu/~luj/3DHIP_Proc_IEEE_2009.pdf)