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Zhaoran (Rena) Huang

Associate Professor

Prof. Rena Huang

Zhaoran (Rena) Huang received her B.S. in Physical Optics from Beijing Institute of Technology, and both her M.S. and Ph.D. in the field of Integrated Optoelectronics and Photonics from the Department of Electrical and Computer Engineering at Georgia Institute of Technology. She later joined the NSF ERC of Microsystem Packaging Research Center (PRC) at Georgia Institute of Technology as a postdoctoral fellow where she led the effort in design and integration of end-to-end optical interconnects on SOP substrate. Dr. Huang joined the faculty of the Electrical, Computer, and Systems Engineering (ECSE) Department of Rensselaer Polytechnic Institute as a tenure track professor in 2005, and was awarded tenure in 2012. Her research spans a wide range of topics, including solid state optoelectronic devices such as photodetectors and modulators, integrated lightwave circuits on Si platform for biological and chemical sensing, foundry based large array optical system integration, and optical interposer and optical packaging. Her current research activities focus on Si photonic devices and integration, on-chip slow-light waveguides, metastructure arrays, and high contrast gratings for applications in phased array antennas, optical neuromorphic computing, subwavelength imaging etc.

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Awards and Recognition

  • In 2012, the article "Integration of inverted InGaAs MSM array to Si substrate through low temperature wafer bonding", by P. Wu at Electron. Lett., Vol. 48, 2012 was selected among five papers to be included in the journal's "In Brief" section in January 2012.
  • In 2011, elected to IEE senior Member
  • In 2010, received NSF RampUp career Campaign Award
  • In 2010, the article "Packaging of dual-mode wireless communication module using RF/optoelectronic devices with shared functional components" by J. Liao et. al. at IEEE Trans. on Adv. Packaging, Vol. 33, 2010 was rated among the top downloaded articles by IEEE CPMT Society Newsletter
  • In 2004, received IEEE Trans. On. Adv. Packaging Commendable Paper Award
  • In 2003, received Best Poster Paper Award of the 53rd ECTC
  • In 2000, received Outstanding Student Poster Award of NSF Microsystem Packaging Research Center
Rena Huang: Copyright 2018