300-mm monolithic CMOS silicon photonics foundry technology

The ever-burgeoning bandwidth requirements for data center infrastructure are intensifying the necessity for optical transceivers to provide faster connectivity solutions at volume scales and cost structure surpassing 100G/l. Optical interconnect utilizing monolithic silicon photonics (SiPh) technology, which enables the large-scale fabrication of state-of-the art photonics and CMOS devices on the same silicon-on-insulator substrate, plays a pivotal role in addressing the scalability, energy consumption and cost efficiency of existing interconnection schemes. This talk will provide an overview of GlobalFoundries Fotonix^TM platform - the world’s first high-volume 300mm monolithic CMOS SiPh foundry offering. The presentation will cover key challenges and recent advancements in low-loss passive SiPh components such as Si and SiN waveguides, couplers, multi-mode interferometers, polarization splitters and rotators, wavelength division multiplexers, and high-performance active devices like Mach-Zehnder modulators, micro-ring modulators, germanium photodetectors and undercut thermal phase shifters. Additionally, it will spotlight the achievements in advanced packaging features including passive V-groove fiber attach, laser attach, Cu pillar and TSV. The presentation will also touch on high-performance RF SOI CMOS, encompassing analog mixed signal devices, digital standard cell libraries as well as best-in-class TIA and drivers. The talk will conclude with a glimpse into GlobalFoundries’ SiPh roadmap aimed at fueling research and innovation to address the growing market demands across various domains beyond data centers.