Advanced packaging enables heterogeneous integration of chiplets, but its promise depends on detecting defects, understanding their consequences, and recovering reliable operation. This talk examines these challenges in two important packaging technologies: fan-out wafer-level packaging (FOWLP) and hybrid bonding. In FOWLP, thermal expansion mismatch, warpage, die shift, and post-molding protrusion can compromise redistribution layer (RDL) alignment and interconnect integrity. The resulting stress and deformation can affect RDLs, through-mold vias, and on-die interconnects. Hybrid bonding introduces additional challenges, including nanoscale voids, contamination, and alignment errors that can compromise electrical connectivity.
This talk will connect these physical defects to electrical fault models and their effects on logic functionality and timing. It will then present recent advances in built-in self-test (BIST) and repair that address these failure mechanisms and help recover usable devices. By linking defect analysis with BIST and repair, the speaker will highlight practical strategies for improving the yield and reliability of chiplet-based systems.
Professor Krishnendu Chakrabarty is the Fulton Professor of Microelectronics at Arizona State University (ASU), where he also serves as Chief Technology Officer of the Department of War Microelectronics Commons Southwest Advanced Prototyping Hub and Director of the ASU Center for Semiconductor Microelectronics. Previously, he was the John Cocke Distinguished Professor and Chair of Electrical and Computer Engineering at Duke University. He also served as a Visiting Professor at NVIDIA during 2022–2023. His research spans 3D integrated circuits, heterogeneous integration, AI accelerators, silicon photonics, hardware security, and AI for healthcare. He has received numerous prestigious awards, including the Humboldt Research Award (2013), IEEE Computer Society Technical Achievement Award (2015), IEEE Circuits and Systems Society Charles A. Desoer Technical Achievement Award (2017), SRC Technical Excellence Award (2018), IEEE Circuits and Systems Society Vitold Belevitch Award (2021), SRC Aristotle Award (2022), SRC Innovation Award (2025), and European Design and Automation Association Achievement Award (2026). He has also received multiple IEEE and ACM Best Paper Awards, over a dozen conference best paper awards, and the Distinguished Alumnus Award from IIT Kharagpur. Professor Chakrabarty is a Fellow of the National Academy of Inventors, ACM, IEEE, and AAAS. His contributions have had a significant impact on semiconductor design, testing, and emerging computing technologies.