James Lu

Professor, Curriculum Chair, IEEE Fellow
Electrical, Computer, and Systems Engineering
CII 6229


Dr.rer.nat. (Ph.D.), Technical University of Munich, Germany

Focus Area

3D Heterogeneous Integration (HI) and Advanced Packaging (AP)

Selected Scholarly Works

Handbook of Wafer Bonding, http://www.wiley.com/WileyCDA/WileyTitle/productCd-3527326464.html; Wiley-VCH Verlag, March 2012. ISBN: 978-3-527-32646-4.

J.-Q. Lu, “3D Hyper-Integration and Packaging Technologies for Micro-Nano-Systems,” Proceedings of The IEEE, “Special Issue: 3D Integration Technology”, 97 (1), pp. 18-30, January 2009. (http://homepages.rpi.edu/~luj/3DHIP_Proc_IEEE_2009.pdf)